Custom Interconnect Limited

Custom Interconnect Limited

Custom Interconnect Limited is a contract electronics manufacturer based in Andover, Hampshire, incorporated in 1986. Certified to ISO 13485:2016, ISO 9001:2015 and JOSCAR, the company runs surface-mount and through-hole assembly on rigid boards with wave, reflow, selective and hand soldering in both leaded and lead-free processes, alongside advanced semiconductor packaging including flip chip, WLCSP, CSP, LGA, chip-on-board and wire bonding. Production is verified through AOI, X-ray, visual, in-circuit, functional, flying probe and thermal cycling testing, with turnkey or customer-nominated component sourcing, PCB design, conformal coating, electro-mechanical assembly, system integration, repair/rework and obsolescence management supporting aerospace and defence, automotive, energy, industrial, medical, space and telecom customers from fast-turn prototypes to high-volume production.

Certifications
ISO 13485 ISO 9001 JOSCAR AS9100
Services
Assembly Box Build Conformal Coating Design Repair/Rework Turn-key PCB Assembly PCB Testing Obsolescence Management
Board Type
Rigid
Assembly Type
Surface Mount Thru Hole
Soldering Type
Hand Soldering Leaded Solder Lead-Free (RoHS) Wave Soldering Reflow Soldering Selective Soldering
Testing
Automated Optical Inspection (AOI) X-Ray Inspection Visual Inspection In-Circuit Testing (ICT) Functional Testing Flying Probe Testing Thermal Aging Testing
Package Type
BGA Flip Chip WLCSP COB LGA
Order Type / Volume
Low Volume Medium Volume Fast Turn Prototype High Volume
Box Build Capabilities
Electro-Mechanical Assembly System/Product Integration
Industries Supported
Aerospace and Defense Automotive Industrial Medical Telecom Energy Space
Component Sourcing / Procurement Model
Turnkey (Full Supply) Free Issue / Customer Supplied
Headcount 201-500
Last Updated
2026-10-02
Custom Interconnect Limited
Company Registration Number 02026753
Verification History

2 Oct 2026 — Scheduled verification (Lite). No changes.

21 Sep 2026 — Scheduled verification (Regular). AS9100 Rev D (Defence and Aerospace) certification confirmed.

12 Sep 2026 — Scheduled verification (Max). JOSCAR registration confirmed. Advanced semiconductor packaging (flip chip, WLCSP, wire bonding), thermal cycling testing, obsolescence management and energy/space sector work added.

12 Sep 2026 — Scheduled verification (Lite). No changes.

5 Sep 2026 — Listing added to EMS Directory, pending verification checks.

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