Asteelflash

Asteelflash

Asteelflash's Bedford site provides surface-mount, through-hole and mixed-technology PCB assembly, with reflow, wave and selective soldering in leaded and lead-free processes and a test and inspection regime covering solder paste inspection, AOI, X-ray, in-circuit, functional, flying probe and hi-pot testing. The facility holds ISO 9001, AS/EN 9100, ISO 14001 and IATF 16949 certification and offers in-house conformal coating, potting and box build through to full system integration and final test, on a turnkey or consigned basis. Part of the international Asteelflash/USI electronics manufacturing network, the operation supports work from prototype and NPI through to volume production for aerospace, consumer electronics, telecom, IoT and industrial customers, with the wider group also serving automotive, medical and clean-energy markets.

Certifications
ISO 9001 AS9100 ISO 14001 IATF 16949
Services
Assembly Design Turn-key PCB Assembly Box Build PCB Reverse Engineering PCB Testing Conformal Coating Repair/Rework Logistics/Distribution Obsolescence Management
Board Type
Rigid
Assembly Type
Surface Mount Thru Hole Mixed
Soldering Type
Leaded Solder Lead-Free (RoHS) Wave Reflow Selective
Testing
AOI X-Ray Inspection ICT Functional Flying Probe Hi-Pot Solder Paste Inspection
PCB Sides
Single Sided Double Sided
Package Type
BGA
Order Type / Volume
Prototype Low Volume Medium Volume High Volume
Box Build Capabilities
Electro-Mechanical Assembly System/Product Integration Gluing/Bonding/Potting Final Product/System Test
Industries Supported
Aerospace and Defense Automotive Building Technology Consumer Electronics Energy Industrial Medical Telecom
Component Sourcing / Procurement Model
Turnkey (Full Supply) Consignment
Last Updated
2026-10-02
Asteelflash
Company Registration Number 02128323
Verification History

2 Oct 2026 — Scheduled verification (Lite). No changes.

12 Sep 2026 — Scheduled verification (Max). Added ISO 9001, AS/EN 9100, ISO 14001 and IATF 16949 certifications (Bedford facility), through-hole and mixed-technology assembly, reflow soldering in leaded and lead-free processes, turnkey and consigned sourcing, low- to high-volume production, potting, electro-mechanical assembly, final system test and repair, and logistics and obsolescence-management services.

12 Sep 2026 — Scheduled verification (Lite). No changes.

5 Sep 2026 — Listing added to EMS Directory, pending verification checks.

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